Thermal Testing Services

 

The reliability and performance of semiconductor devices and electronic equipment is  dependent upon its thermal design and operating temperature.

Field failure rates for electronic equipment has shown to relate to the device junction temperature as given by the Arrehenuis equation. It is a known fact that higher junction temperature in IC semiconductor devices results in higher failure rates and may lead to catastrophic failure.

Thermal management and design at the earliest stage of product development ensures that the product field reliability target goals are achieved.

What does ARTT offer:

2.  Engineering Analysis of the test results, provide a comprehensive evaluation of the thermal data indicating areas for improvement.

3.  Solutions for the thermal problems.

4.  Field failure rates as MTBF assessment based upon the actual temperature measurement of your product at the component case and/or junction temperature. Overall reliability projections.

Thermal Characterization:

 

We are the only company that can assist you in all the three stages of product development still keeping your application conditions and objectives with solutions.

 

1.  Package characterization and assessment, which includes device characterization for package thermal resistance measurements; junction to ambient  è_JA ,  junction to case è_JC , and case to ambient è_CA . The tests are performed at still air and at any given required airflow rates.

 

2.  Printed Circuit Board thermal characterization and assessment to identify hot spot on the board, and identify areas for thermal design improvement.

 

3.  Chassis assessment to identify slot to slot and front to back temperature variation.

 

4.  System characterization which may consist of several chassis in a Bay to assess thermal and airflow characteristics. Identify airflow and heat flow problem under natural or forced air convection cooling. Recommend solutions in case of problem identification.

 

Engineering Assessment

Solution for potential thermal problems

 

We can take you to the next step to provide you with a complete engineering assessment of the thermal issues involved and work with you to achieve the desired objectives. We can provide solutions at every stage of the product design and development;

 

1.  At the IC package level in designing heat sinks, thermal electric cooler, heat pipes, conduction  plates, fan or any other applicable cooling device.

 

2.  At the printed circuit board, chassis design, or at the system integration level identify hot spots, and thermal problems. We will recommend solutions based upon engineering evaluation and test data, develop system impedance curve to assess airflow requirements and select proper size fans or blowers or any other cooling device required.

Field Failure Reliability Assessment

 We are the only firm that will provide you with realistic MTBF values based upon the measured temperature results. These are obtained at the

1.  Device or package thermal characterization stage.

2.  Thermal characterization of the printed circuit board and BOM analysis.

3.  Thermal characterization of the Chassis and/or of the System at the application ambient air environmental conditions.

 The MTBF numbers will be based upon the Mil Standard 217E, JEDEC/IEEE or the IEC method of MTBF and/or MTTF predictions.

 We will work with you to meet your target MTBF and FIT rate requirements in the field with recommending solutions.

Thermal Test Equipment:

 What we will use to perform the work

•  Wind Tunnel Servo control

•  Datalogger and Thermocouples

•  Thermal Analyzer, Diode Calibration Techinque per JEDEC or IEEE standards

•  Infra-red Thermal Camera

•  Hot wire Anemometer, airflow meter

•  Exposed DIE under power thermal imaging system.

•  Still air chamber or Heat Box

•  Power supplies

•  Software, RELEX, RSI, MiniTab,Statistica,SPY,

4848 San Felipe Road Suite 150-119 San Jose, CA 95135

1030 East El Camino Real #436 Sunnyvale, CA 94087-3759

408-532-9029  1-877-927-2925

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Last modified: 06/21/04